CYV15G0101DXB-BBXC
CYV15G0101DXB-BBXC
IC TELECOM INTERFACE 100TBGA
Availability:
19502
pieces
Specifications
| Mount | Surface Mount |
|---|---|
| Width | 11mm |
| Series | HOTlink II™ |
| Function | Transceiver |
| Interface | LVTTL |
| Lead Free | Lead Free |
| Packaging | Tray |
| Published | 2004 |
| Technology | BICMOS |
| Part Status | Active |
| Pbfree Code | yes |
| RoHS Status | ROHS3 Compliant |
| Subcategory | Network Interfaces |
| JESD-609 Code | e1 |
| Mounting Type | Surface Mount |
| Terminal Form | BALL |
| Number of Pins | 100 |
| Package / Case | 100-LBGA |
| Supply Voltage | 3.3V |
| Telecom IC Type | INTERFACE CIRCUIT |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Base Part Number | CY*15G01 |
| Current - Supply | 390mA |
| Voltage - Supply | 3.135V~3.465V |
| Factory Lead Time | 15 Weeks |
| Terminal Position | BOTTOM |
| Number of Channels | 1 |
| Radiation Hardening | No |
| Operating Temperature | 0°C~70°C |
| Nominal Supply Current | 500mA |
| Number of Terminations | 100 |
| Number of Transceivers | 1 |
| Operating Supply Voltage | 3.3V |
| Peak Reflow Temperature (Cel) | 260 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
